All conferences / EMSOFT / 2023
EMSOFT 2023
23rd International Conference on Embedded Software
Submission timeline
- 16 Mar 2023 Abstract registration AoE
- 23 Mar 2023 Full paper AoE
- 30 Jun 2023 Notification
- 17 Sep 2023 Conference opens
What to submit
- Format
- 20 pages in ACM one-column format
- Proceedings
- ACM/IEEE — ACM Digital Library
EMSOFT 2023 has a dual publication model with two tracks. Journal track papers will be published in ACM Transactions on Embedded Computing Systems (TECS) and Work-in-Progress track papers will be published in the ESWEEK Proceedings. Double blind process. No appendix. Part of ESWEEK (with CODES and CASES). Firm deadline (2015, 2016, 2018, 2019, 2021, 2022, 2023).
Call for papers
- As first published EMSOFT-2023.txt · TXT · shown below
- As first published EMSOFT-2023.pdf · PDF
Posters, images and calls for participation are kept for the record but not reproduced here.
The call, as published
Reproduced verbatim from the organisers’ announcement. The conference’s own page is at esweek.org/emsoft/.
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EMSOFT 2023
Call for Papers
International Conference on Embedded Software
Hamburg, Germany, September 17-22, 2023
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The ACM SIGBED International Conference on Embedded Software (EMSOFT)
brings together researchers and developers from academia, industry,
and government to advance the science, engineering, and technology of
embedded software development. Since 2001, EMSOFT has been the premier
venue for cutting-edge research in the design and analysis of software
that interacts with physical processes. Specifically, the conference
has a long-standing tradition of presenting results on cyber-physical
systems, which integrate computation, networking, and physical dynamics.
https://esweek.org/wp-content/uploads/2023/01/CFP-EMSOFT-ESWEEK2023.pdf
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Timeline
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Journal Track:
- Abstract Submission: March 16, 2023 (AoE)
- Full Paper Submission: March 23, 2023 (AoE, firm)
- Notification of Acceptance: June 30, 2023
Work-in-Progress Track:
- Paper Submission: May 22, 2023 (AoE, firm)
- Notification of Acceptance: June 19, 2023
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Topics of Interests / Tracks
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- Embedded distributed, networked systems
* Time-critical embedded systems
* Multi-/many-core processors, hardware accelerators
* Embedded operating systems and middleware
* Scheduling, resource allocation, and execution time analysis
* QoS management and performance analysis
* Hardware and software co-design
- Embedded software design and analysis
* Energy-efficient embedded software
* Safety/Mixed-critical embedded software
* Software design for cyber-physical systems
* Embedded software architectures for data-intensive applications and signal processing
- Resilience
* Embedded software security
* Robust implementation of control systems
- Process, methods
* Formal modeling and verification
* Testing, validation, and certification
* Model- and component-based approaches
- Empirical studies and their reproduction
- Sustainability, energy sobriety, low techs
- Application areas including automotive, avionics, energy, health care, mobile devices, multimedia, machine learning, and autonomous systems
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Journal-Integrated Publication Model
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EMSOFT 2023 has a dual publication model with two tracks. Journal track
papers will be published in ACM Transactions on Embedded Computing
Systems (TECS) and Work-in-Progress track papers will be published in the
ESWEEK Proceedings. See details at https://esweek.org/author-information/
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Organization
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EMSOFT Program Chairs:
Claire Pagetti, ONERA, France
Alessandro Biondi, Scuola Superiore Sant'Anna, Italy
ESWEEK General Chairs:
Xiaobo Sharon Hu, University of Notre Dame, USA
Alain Girault, INRIA, France
www.esweek.org