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EMSOFT 2019
19th International Conference on Embedded Software
Submission timeline
- 5 Apr 2019 Abstract registration
- 12 Apr 2019 Full paper
- 10 Jul 2019 Notification
- 13 Oct 2019 Conference opens
What to submit
- Format
- 10 pages in ACM two-column format
- Proceedings
- ACM/IEEE — ACM Digital Library
Double blind process. Up to 10 pages appendix. Part of ESWEEK (with CODES and CASES). Firm deadline (2015, 2016, 2018, 2019). This year EMSOFT will follow a two-stage review process, in which papers passing the first stage of reviews will be asked to revise their work based on reviewer comments within a short time frame of around two weeks. ESWEEK 2017 will introduce a journal-integrated publication model where the majority of papers will be published in the ACM Transactions on Embedded Computing Systems (TECS).
Call for papers
- As first published EMSOFT-2019.txt · TXT · shown below
The call, as published
Reproduced verbatim from the organisers’ announcement. The conference’s own page is at www.esweek.org/emsoft/about.
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EMSOFT 2019
Call for Papers
International Conference on Embedded Software
October 13 – October 18, 2019, New York City, USA
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The ACM SIGBED International Conference on Embedded Software (EMSOFT)
brings together researchers and developers from academia, industry, and
government to advance the science, engineering, and technology of embedded
software development. Since 2001, EMSOFT has been the premier venue for
cutting-edge research in the design and analysis of software that
interacts with physical processes, with a long-standing tradition for
results on cyber-physical systems, which compose computation, networking,
and physical dynamics.
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Timeline
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Journal-Track Submissions
- Abstract: April 5, 2019
- Full Paper: April 12, 2019 (firm)
Work-in-Progress Submissions
- June 7, 2019 (firm)
Notification of Acceptance
- July 10, 2019 (both tracks)
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Topics of Interests / Tracks
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Submissions are invited on all aspects of embedded software systems,
including but not limited to:
* Embedded software design and analysis
* Formal modeling and verification
* Testing, validation, and certification
* Model- and component-based approaches
* Embedded Operating systems and middleware
* Embedded distributed, networked systems
* Embedded software on multi- and many-core processors
* Safety-critical and mixed-critical embedded soft-ware design
* Time-critical embedded systems
* Scheduling and execution time analysis
* QoS management and performance analysis
* Energy-efficient embedded software
* Embedded software security
* Embedded software architectures for intensive data and signal processing
* Software design for cyber-physical systems
* Robust implementation of control systems
* Empirical studies and their reproduction
* Application areas including automotive, avionics, energy, health care,
mobile devices, multimedia, machine learning, and autonomous systems
A special day focusing on the Internet of Medical Things will be organized
jointly by all conferences in ESWEEK. Papers aligned to the topics of
interest for EMSOFT, focusing on Medical Cyber-Physical Systems with an
emphasis on software for health care are welcome.
Papers should represent original work, not formerly published or submitted
for publication in other forums. A blind review process will be enforced.
Authors should not reveal authorship directly or indirectly through
references.
EMSOFT will follow a two-stage review process, where papers passing the
first stage of reviews will be asked to revise their work based on
reviewer comments within a short time frame of around two weeks. Accepted
papers will participate in the direct journal publication track and
appear in ACM TECS (see below).
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Paper Process
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EMSOFT 2019 has a dual publication model where papers will be published
in two tracks: Journal track papers will be published in the ACM
Transactions on Embedded Computing Systems (TECS) and Work-in-Progress
track papers will be published in the ESWEEK Proceedings.
More details at https://www.esweek.org/author-information.
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Organization
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EMSOFT Program Chairs:
Sriram Sankaranarayanan, U. of Colorado Boulder, USA
Timothy Bourke, Inria Paris, France
ESWEEK General Chairs:
Petru Eles, Linköping University, SE
Tulika Mitra, National University of Singapore, SG
www.esweek.org