All conferences / SIES / 2024
SIES 2024
14th International Symposium on Industrial Embedded Systems
Submission timeline
-
30 Jun 2024
Full paper
11 Jun 2024→ 30 Jun 2024 +19 days - 28 Jul 2024 Notification
- 23 Oct 2024 Conference opens
What to submit
- Format
- 8 pages IEEE (long), 4 pages (work in progress)
- Proceedings
- IEEE eXplore — Paywalled
- Reviewing
- Double blind
- Awards
- 3 outstanding papers
- Chairs and
invited speakers - Mixed genders How this is counted
- Journal
- SIES 2024 will have two special issues: one in the Journal of Systems Architecture (JSA) and one in Leibniz Transactions on Embedded Systems (LITES).
Student Travel Grants. No edition from 2018 to 2023.
Call for papers
- After a deadline extension SIES-2024-extended.txt · TXT · shown below
- As first published SIES-2024.txt · TXT
- As first published SIES-2024.pdf · PDF
Posters, images and calls for participation are kept for the record but not reproduced here.
The call, as published
Reproduced verbatim from the organisers’ announcement, after a deadline extension. The conference’s own page is at ieee-sies.org/.
2024 IEEE 14th International Symposium on Industrial Embedded Systems (SIES 2024) Deadline extended to 30th June 2024 NEWS: This year, SIES will have two special issues: one in the Journal of Systems Architecture (JSA) and one in Leibniz Transactions on Embedded Systems (LITES). Chengdu, China, October 23-25, 2024 Official Website: https://ieee-sies.org/ 2024 IEEE 14th International Symposium on Industrial Embedded Systems (SIES 2024) will be held from 23 to 25 October in Chengdu, China. SIES 2024 is co-sponsored by IEEE and University of Electronic Science and Technology of China, China, technically sponsored by IEEE Future Networks, EMSIG, Virginia Tech, etc. The aim of the symposium is to bring together researchers and practitioners from industry and academia. SIES provides a platform to report on recent developments, deployments, technology trends and research results, as well as to discuss and start initiatives related to embedded systems and their applications in a variety of industrial environments. * Conference History The SIES series were hosted by: - University of Nice Sophia Antipolis, France (2006) - Uninova, Portugal (2007) - LIRMM/CNRS, France (2008) - Ecole Polytechnique Fédérale de Lausanne, Switzerland (2009) - University of Trento, Italy (2010) - Malardalen University, Sweden (2011) - Karlsruhe Institute of Technology, Germany (2012) - Polytechnic Institute of Porto, Portugal (2013) - Scuola Superiore S. Anna, Italy (2014) - Siegen University, Germany (2015) - AGH UST, Poland (2016) - France (2017) - Graz University of Technology, Austria (2018) * Conference Proceedings All the accepted regular full papers will be included in IEEE Conference Proceedings and submitted for Ei Compendex & Scopus index. *Submission Types: - Long Paper (up to 8 double-column pages) - WiP Papers (up to 4 double-column pages) - Poster Presentation * Important Dates: SUBMISSION DEADLINE: 30th June 2024 NOTIFICATION DATE: 28th July 2024 REGISTRATION DEADLINE: 20th August 2024 * Submission By EasyChair: https://easychair.org/my/conference?conf=sies2024 * Call for papers Topics of interest include, but are not limited to: - EMBEDDED SYSTEMS - SYSTEM-ON-CHIP AND NETWORK-ON-CHIP DESIGN & TESTING - NETWORKED EMBEDDED SYSTEMS AND EDGE COMPUTING - EMBEDDED APPLICATIONS * SIES Awards OUTSTANDING PAPER AWARD BEST REVIEWER AWARD BEST PAPER AWARD BEST WIP PAPER AWARD BEST PRESENTATION AWARD * Venue: Xiangyu Hotel (pending) Address: No.10, North Renmin Road, Chengdu, China * Contact: Conference Secretary Ms. Amy J.Y.Hu Email: ieee-sies@academic.net More information, please refer to: https://ieee-sies.org/