------------------------------------------------------------------------------- ***** Deadline for submission of regular papers: February 25, 2018 ***** ***** Deadline for submission of work-in-progress papers: April 13, 2018 ***** CALL FOR REGULAR & WORK IN PROGRESS PAPERS -------------------------------------------------------------------------------- SIES 2018 13th IEEE International Symposium on Industrial Embedded Systems June 6-8, 2018, Graz, Austria INTRODUCING: CO-LOCATED 2nd Symposium on Dependable IoT - 5 June 2018 Sponsors: IEEE Council on Electronic Design Automation Embedded Automotive Systems Group, TU Graz -------------------------------------------------------------------------------- Web site: http://sies2018.tugraz.at -------------------------------------------------------------------------------- The IEEE symposium brings together researchers and practitioners from industry and academia and provides them with a platform to report on recent developments, deployments, technology trends and research results, as well as initiatives related to embedded systems and their applications in a variety of industrial environments. -------------------------------------------------------------------------------- FOR TRACK CHAIRS & TOPICS SEE THE CONFERENCE WEB SITE -------------------------------------------------------------------------------- General Co-Chairs: Marcel Baunach, TU Graz, Austria Roman Obermaisser, University of Siegen, Germany Program Committee Co-Chairs: Stig Petersen, SINTEF, Norway Roberto Passerone, Univ of Trento, Italy WiP and Posters Co-Chairs: Tobias Hoßfeld, University of Duisburg, Germany Haibo Zeng, VirginiaTech, USA IEEE CEDA Representative: Yao-Wen Chang, National Taiwan University, Taiwan Finance Co-Chair: Richard Zurawski, ISA Group, USA Carlo Alberto Boano, TU Graz, Austria SIES Series Steering Committee: R. Ernst, TUB, Germany G. De Micheli, EPFL, Switzerland R. Gupta, UC San Diego, USA A. Sangiovanni-Vincentelli, UC Berkeley, USA R. Zurawski, ISA Group, USA International Advisory Committee: J. J. Chen, KIT, Germany E. Dekneuvel, UNSA, France M. Di Natale, Scuola Superiore S. Anna, Pisa, Italy L. Gomes, Uninova, Portugal T. Nolte, Mälardalen University, Sweden R. Obermaisser, University of Siegen, Germany R. Passerone, Univ. of Trento, Italy G. Sassatelli, LIRM, France J-L Scharbarg, ENSEEEIHT, France E. Tovar, IPP, Portugal A. Vachoux, EPFL, Switzerland -------------------------------------------------------------------------------- SUBMISSIONS: Two types of submissions are solicited. Long Papers from 6 to 10 double column pages in a font no smaller than 10-points. Work-in-Progress limited to 4 double column pages in a font no smaller than 10-points. FOR SUBMISSION DETAILS SEE THE CONFERENCE WEB SITE -------------------------------------------------------------------------------- POST CONFERENCE PUBLICATION A special section in IEEE Transaction on Industrial Informatics (IF of 4.708) will be organized based on selected papers from the SIES2017 symposium. ------------------------------------------------------------------------------- INTRODUCING: CO-LOCATED 2nd Symposium on Dependable IoT - 5 June 2018 for details, see SIES2018 web site ------------------------------------------------------------------------------- CONTACT INFORMATION E-mail: sies2018@iti.tugraz.at ------------------------------------------------------------------------------- Web site: http://sies2018.tugraz.at -------------------------------------------------------------------------------- ***** Deadline for submission of regular papers: February 25, 2018 ***** ***** Deadline for submission of work-in-progress papers: April 13, 2018 ***** --------------------------------------------------------------------------------